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Copper Plated Stainless Steel
It appears that in the presence of a high energy
magnetic flux, that there is some type of interaction involving photon
activity.
From: "axmesumpin"
<JDEnterprizes@mailblocks.c*>
To: <pes_isbp@yahoogroups.com>
Sent: Wednesday, June 30, 2004 7:31 PM
Subject: [pes_isbp] Important Message to Group Members:
Hello People,
I now have found what I believe to be good evidence to indicate that
"Copper Plated Stainless Steel" could indeed play a key role in the
function of an ISBP device.
After many months of searching for this material, I have found only two direct
uses for it. One being hard to find exotic roofing materials and the other
particle accelerator's or "Cyclotrons" and super colliders.
I had asked for samples from one of the two roofing supply companies of which I
have found, the second company has only appeared in searches recently and I will
to try to get some samples as well. The samples that I have received from the
first company nearly a full year ago, turned out to be pure copper, NOT copper
plated stainless steel as was it was advertised as being.
After reading the information on the reasons for the use of this particular
metal combination in nuclear science, it appears that in the presence of a high
energy magnetic flux, that there is some type of interaction involving photon
activity.
I do not yet have enough information to make a complete assessment of how or why
this is, only that they have chosen this particular metal combination to use
with cyclotron and/or particle accelerator technologies.
I challenge you all to look into this further if you can find the time as it
does appear to have something to so with the processes that are going on in an
ISBP type device. If this is indeed the case, the odds of a person assembling
all of these particular materials in the exact way that I had, to produce a high
energy magnetic beam might very well be comparable to winning the mega-lotto two
times in the same week.
Try searching for "Copper Plated Stainless Steel Sheet Metal" or even
just "Copper Plated Stainless Steel" and see what you come up with.
Remember, we are looking for a source from whom we can make small purchases at
this time as we are not yet a company.
Jim
From: "constp2000"
<constp2000@yahoo.co.u*>
To: <pes_isbp@yahoogroups.com>
Sent: Wednesday, June 30, 2004 11:45 PM
Subject: [pes_isbp] Re: Important Notice to all ISBP Buider's:
Why not electroplating stainless steel band?
Any good ideas what the cheapest way should be? I think one could use
an electrolyte containing copper.
From: "Howard Rogers" <cyclesandgardens@yahoo.c*>
To: <pes_isbp@yahoogroups.com>
Sent: Thursday, July 01, 2004 12:07 AM
Subject: Re: [pes_isbp] Re: Important Notice to all ISBP Buider's:
I don't know if this will work well on stainless,
but years ago, I did some copper plating with
copper sulfate, CuSO4, bluestone. The right
amperage and voltage must be selected to ensure that
the coating is not fuzzy and loose. The stainless
needs to be completely degreased, this means no
touching with bare hands, as the oils on the fingers
will stop the copper from adhering properly.
The amperage will control the rate of deposition
of the copper. The voltage is available from
electronegative tables by summing the
electronegative of copper, and that of the sulphate
ion. The farther apart the electrodes, and the
larger the area, the more amps needed. You should
probably use a regulated power supply.
Sourcing & Info
From: "axmesumpin"
To: <pes_isbp@yahoogroups.com>
Sent: Friday, July 02, 2004 4:02 AM
Subject: [pes_isbp] Copper plated stainless steel resources:
Below are what links that I have been able to find to possible
resources for "Copper Plated Stainless Steel" sheet metal. I would
tend to be leery of the roofing places because some of them offer
copper plated stainless but deliver only pure copper. It might seem a
little goofy to think of using a pot rack but it appears to be the
type of metal we are looking for.
Copper plated 15 inch diameter hoop $59.00
Here's an oval 15 inch by 30 inch pot rack without an insert, $69.00
Questions???? Comments??? E-mail us at paul@topgrill.com
http://stores.yahoo.com/gasgrillguy/15inchhoop.html
The Iron Works:
Call us toll-free at 1-800-811-9890 for questions or orders
http://www.theironworks.com/copper_pot_racks.html
Future Roof
http://www.futureroof.com/coppercoatedstainlesssteel.html
1 (800) 959-8089
Next are links to metal Plating Companies:
SELECT-TRON INDUSTRIES, INC.
1946 E. 12th St.
Erie, PA 16511
Tel: 814-459-0904
Fax: 814-459-1530
Epner Technology Inc.
25 Division Place
Greenpoint, NY 11222
Tel: 800-823-7637
Fax: 718-963-2930
Or Call: 718-782-5948, Ext. 20
Del's Plating Works
8736 Schumacher
Houston, TX 77063 5693
Tel: 877-311-0123
Fax: 713-784-6613
Or call:713-785-4955
GSP "GENERAL SUPER PLATING COMPANY, INC
Contact Ken:
Kenneth B. Spatola
Phone: (978) 834-0662
Fax: (978) 834-0664
kb_spatola@netzero.net
GSP "GENERAL SUPER PLATING COMPANY
5762 CELI DRIVE
EAST SYRACUSE, NY 13057
Phone: 315 - 446 - 2264
Fax: 315 - 446 - 4419
And Finally, Information on plating techniques:
STAINLESS STEEL CAN BE PLATED WITH THE FOLLOWING PROCESS:
[From http://www.samson24k.com/detailp.html]
To plate stainless steel, you must clean the surface with a strong detergent
making sure all surface oil, grease and other contaminants have been removed.
Rinse with clean water. Plate with nickel strike or Samson SS Preplate with a
thin coat that is hardly visible, one to two passes over the work piece, rinse
with clean water and plate with gold, silver or other finish metals.
What factors affect the amount of copper plated from a CuSO4 solution? What
factors affect the amount of copper collected on the cathode when two copper
electrodes are placed in a solution of copper sulphate and an electric current
is passed through? Tanith (pam.blackman@lineone.net) In your experiment, the
copper in the anode (positive electrode) will ionize and dissolve, Cu(s) =
Cu2+(aq) + 2e- and copper(II) ions from the solution will be deposited on the
cathode (negative electrode): Cu2+ (aq) + 2e- = Cu(s) With some care, the copper
deposited on the electrode will be purer than the copper the anode was made of.
This is called electrorefining and it's used to purify metals in industry. For
every mole of copper deposited at the cathode, you'll need to supply 2 moles of
electrons (and one mole of Cu2+). So you'd expect that two factors in
determining the mass of copper deposited would be the following: Total charge
transferred to the cathode. This will be equal to the current (charge per
second) times the number of seconds the current is applied. Two ways to increase
the amount of copper deposited, then are to increase the amount of current
applied increase the length of time the current is applied Increasing the
current too much will deplete the solution at the surface of the cathode of
Cu2+, and the hydrogen may be reduced along with the copper: 2H+(aq) + 2e- =
H2(g) The little bubbles of hydrogen gas forming at the cathode surface will
produce a brittle, poorly adhering copper deposit. Stirring the solution during
the electrolysis will minimize prevent hydrogen reduction at the cathode, but
you'll find that there's a limit to the amount of current you can use (and the
potential you can apply to the cathode). If you add a little nitrate, it will be
reduced to ammonia at the cathode. Reduction of nitrate will compete with and
effectively prevent reduction of hydrogen on the copper surface, and the
deposited copper will be smooth, shiny, and very pure. Solution composition. The
concentration of the Cu2+ ion will influence the amount of copper you see
deposited. For the reduction of Cu2+ ion at the cathode, Cu2+ (aq) + 2e- = Cu(s).
The Nernst equation implies that the cathode's potential is proportional to the
log of the molarity of Cu2+: E = Eo + (RT/nF) ln [Cu2+] where Eo is the
electrode potential under standard conditions (about +0.34 V for this reaction),
n is the number of moles of electrons transferred (2 moles of electrons per mole
of Cu deposited), F is the charge per mole of electrons transferred (F = 96487
Coulombs/mol), R is the gas law constant (8.31451 J/mol K; isn't it interesting
how this constant crops up in places that have nothing to do with ideal gases?)
and [Cu2+] is the molarity of the copper(II) ions in the solution. When [Cu2+ ]
is less than 1 M, the log term will be negative, and the electrode potential
will be more negative. That means that the lower the concentration of Cu2+, the
more negative potential (applied voltage) will be required. For a given applied
voltage then, the more dilute the CuSO4 solution is, the less copper will be
deposited on the cathode. This isn't a bad thing, if your objective is purifying
the copper. Using a highly concentrated copper(II) ion solution will deposit
more copper on the cathode, but the deposit may be spongy or coarse and will not
adhere well to the cathode. Commercial electroplating operations keep metal
cation concentrations (and current density) low. Other factors: Most chemical
reactions go faster at higher temperatures. More copper will deposit from a warm
copper(II) sulfate solution than a cooler one, all other things being equal.
Other ions in solution will surround and impede the copper(II) ions at the
cathode surface, slowing down the rate of electrodeposition. The condition of
the electrode surface and the positioning and shape of the electrodes influences
electrodeposition rates.
See also
Page posted by SDA
June 28, 2004
Last updated July 02, 2004
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